Description
EC25 bare modules for integration
Quectel EC25 LCC modules are LTE Cat 4 components intended for integration into a host PCB. This page focuses on the bare-module package, power supply and document selection. For a comparison across regional suffixes and hardware forms, see the EC25 family selection page.
Identify the model in each photograph
The main image is a generic EC25 family illustration with an EC25XX placeholder label. The two gallery photographs show EC25-EUX bare modules; the photograph below shows EC25-EC. These examples do not identify a single supplied configuration. Confirm the complete manufacturer part number and hardware/firmware revision with your quotation.
LCC, Mini PCIe and carrier boards
| EC25 LCC bare module | Soldered component for a host PCB. Reference dimensions: 29.0 x 32.0 x 2.4 mm in the EC25 Series specification V3.1. |
|---|---|
| EC25 Mini PCIe | A separate PCI Express Mini Card form factor. Quectel lists 51.0 x 30.0 x 4.9 mm on its Mini PCIe product page. Use its own hardware and electrical documentation. |
| Carrier board or dongle | An assembly with its own connectors, power-input circuitry and accessories. Module supply voltage does not define the external input voltage of an assembly. |
Bare-module design reference
The following values are from Quectel EC25 Series specification V3.1, pages 1, 2 and 5, for the variants tabulated there. The EC25-EUX column is relevant to the labeled gallery examples. EC25-EC appears in the introductory list but has no separate parameter column in this PDF; obtain its applicable document before making design decisions.
| Package / technology | LCC; LTE Cat 4, 3GPP Release 11 |
|---|---|
| Dimensions | 29.0 x 32.0 x 2.4 mm |
| Module supply | 3.3-4.3 V; typical 3.8 V. Review the applicable hardware design for supply transients and PCB implementation. |
| Temperature | Operating: -35 to +75 C; extended: -40 to +85 C. Use the applicable conditions in the hardware document. |
| Theoretical data rates | LTE-FDD: up to 150 Mbps downlink / 50 Mbps uplink. LTE-TDD: up to 130 Mbps downlink / 30 Mbps uplink where supported. |
| EC25-EUX radio reference | LTE-FDD B1/B3/B7/B8/B20/B28A; LTE-TDD B38/B40/B41; WCDMA B1/B8; GSM/EDGE B3/B8. This is the EUX column, not an EC25-EC or Mini PCIe specification. |
| GNSS and other functions | GNSS is optional. Confirm the ordered configuration, firmware, available interfaces and network support. |
Integration checks before ordering
- Match the exact suffix to the destination country, operator and network bands.
- Obtain the applicable hardware design, mechanical drawing and recommended footprint; review power, RF routing, antenna design and thermal conditions.
- Confirm USB/UART, SIM, optional GNSS and software requirements for the chosen configuration.
- Review pin assignments and firmware before replacing another module. Shared family names or package dimensions do not guarantee a direct replacement.
Specifications and compliance documents
Official EC25 Series specification V3.1 | Quectel LCC product and document access | Separate Mini PCIe product information
The retained V2.9 specification is available through the Datasheet Center. Confirm document applicability to your complete part number. Regulatory and operator documents can be reviewed for that configuration and destination market during quotation; a logo on a sample or a family specification does not establish certification of every module or completed host.
Request the required configuration
Send the complete model suffix, destination country and operator, quantity, host interface and optional features. Confirm whether the quote covers bare modules only or a separate board assembly, and specify any required technical or compliance documents.
Send your EC25 requirements for a quotation
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